Thermal resistance matching for thermoelectric cooling systems
(چکیده مقاله) :
Abstract :
The demand of compactness and light-weight for thermoelectric applications requires optimized system integration
of thermoelectric module and heat sinks to achieve the best performance under size and weight
constraints. This work studies the thermal resistance matching (i.e., optimal thermal resistance allocation of
thermoelectric module and heat sinks) for real thermoelectric cooling systems via an integrated theoretical and
experimental method. A theoretical model is first developed to study the relationship of thermal resistance
allocation and the system cooling power under different operating currents. Modeling results indicate that the
optimal thermal resistance of thermoelectric module should account for 40–70% of the total thermal resistance.
The effectiveness of thermal resistance matching is then demonstrated in the selection of an optimal thermoelectric
module among 73 off-the-shelf modules to develop a portable thermoelectric cooling system. By comparing
the cooling performance of two thermoelectric cooling systems with and without thermal resistance
matching, it is experimentally demonstrated that the system with thermal resistance matching achieved
10.7–19.8% larger cooling power under the same size and weight constraints. This can be used as a guideline for
optimal design of thermoelectric cooling systems
of thermoelectric module and heat sinks to achieve the best performance under size and weight
constraints. This work studies the thermal resistance matching (i.e., optimal thermal resistance allocation of
thermoelectric module and heat sinks) for real thermoelectric cooling systems via an integrated theoretical and
experimental method. A theoretical model is first developed to study the relationship of thermal resistance
allocation and the system cooling power under different operating currents. Modeling results indicate that the
optimal thermal resistance of thermoelectric module should account for 40–70% of the total thermal resistance.
The effectiveness of thermal resistance matching is then demonstrated in the selection of an optimal thermoelectric
module among 73 off-the-shelf modules to develop a portable thermoelectric cooling system. By comparing
the cooling performance of two thermoelectric cooling systems with and without thermal resistance
matching, it is experimentally demonstrated that the system with thermal resistance matching achieved
10.7–19.8% larger cooling power under the same size and weight constraints. This can be used as a guideline for
optimal design of thermoelectric cooling systems
(توضیحات تکمیلی) :
(توضیحات تکمیلی) :
Description :
مقاله ISI انگلیسی اصلی
سال انتشار:2018
فایل ISI انگلیسی اصلی ، با فرمت Pdf
تعداد صفحات فایل ISI انگلیسی اصلی: 8 صفحه
سال انتشار:2018
فایل ISI انگلیسی اصلی ، با فرمت Pdf
تعداد صفحات فایل ISI انگلیسی اصلی: 8 صفحه
Authors / Descriptions(نویسندگان/توضیحات): Xing Lua,b,1, Dongliang Zhaob,1, Ting Maa, Qiuwang Wanga,⁎, Jintu Fanc,⁎, Ronggui Yangb
Sent date(تاریخ ارسال) :
1397/10/07 | 12/28/2018
Number of visits(تعداد بازدید):
3256
Key words (کلمات کلیدی):
Thermal resistance matching for thermoelectric cooling systems (مقاله ISI - سال انتشار:2018)
Number of pages(تعداد صفحات) :
8
| نظرات کاربران در مورد این آگهی | |
|
در حال حاضر هیچ نظری ثبت نگردیده است .
|
|